Engineer, Development Engineering, Silicon Integration Singapore, Singapore

Position: ENGINEER, PACKAGE DEVELOPMENT ENGINEERING, PACKAGE SILICON INTEGRATION Singapore, Singapore

ENGINEER, PACKAGE DEVELOPMENT ENGINEERING, PACKAGE SILICON INTEGRATIONSingapore, Singapore

• * Our vision is to transform how the world uses information to enrich life for all.
• * Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
• * About Micron Technology, Inc.
• * Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.

Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

# Engineer Package–Silicon Integration

In this role, you will work closely with experienced engineers across silicon design, wafer fabrication, package design, and assembly teams to learn Micron’s technology development processes, contribute to defined engineering tasks, and support execution of package–silicon integration activities.

You will operate with close guidance and mentoring, building foundational technical skills while contributing to team objectives.

This position is designed for early‐career engineers and provides structured exposure to semiconductor packaging, integration risks, and cross‐functional collaboration within a high‐volume manufacturing environment.

Key Responsibilities

• Support chip‐package interaction (CPI) assessments by collecting data, performing basic analysis, and documenting results under guidance from senior engineers.
• Assist package design, scribe design, and assembly engineers in investigating wafer dicing, singulation, and integration topics.
• Participate in DFMEA / PFMEA activities by helping prepare inputs, reviewing risk items, and tracking action items.
• Work with wafer fab, R&D, and manufacturing teams to support yield, quality, and manufacturability issue investigations.
• Support execution of test vehicles and DOEs, including data collection, basic analysis, and report preparation.
• Learn Micron’s package and silicon development flows, design rules, and change‐management processes.
• Prepare technical documentation and presentation materials for design reviews, project updates, and knowledge sharing.
• Escalate technical issues and risks promptly and seek guidance when encountering unfamiliar problems.

Required Qualifications

Education & Experience

• Bachelor’s or Master’s degree in Engineering (Mechanical, Materials Science, Electrical, Chemical, or related discipline).
• * < 2 years of relevant experience, including internships, co‐op programs, or research experience in semiconductor, materials, or manufacturing fields.

Technical & Professional Skills

• Fundamental understanding of semiconductor manufacturing and/or packaging concepts (coursework or internship level).
• Exposure to structured problem‐solving methods (FMEA, DOE, data analysis) through academics or internships.
• Ability to follow defined engineering procedures, analyze straightforward technical problems, and learn from feedback.
• Strong attention to detail and willingness to learn new tools, processes, and technologies.
• Basic proficiency in Microsoft Excel, Word, and Power Point for data analysis and documentation.
• Good written and verbal communication.