Semiconductor Advanced Packaging Engineer - Irvine, California

Intermedia Group, Inc.9 months ago
Lake Forest, CA, United States
On-site
Full-time
Junior Level (1-3 years)

Job Description

Position Overview

Principal Application Engineer - Semiconductor Advanced Package. Location: Irvine, California Salary: $120,000 to $150,000. This position is with our Adhesive Technologies business unit – where we empower our people to transform industries and provide our customers with a competitive advantage through adhesives, sealants and functional coatings. Industry: Manufacturing & Production. Job Category: Engineering - Industrial / Manufacturing.

Responsibilities: Key Responsibilities

  • Provide technical engineering support for the company's Advanced Packaging Material products and develop in-depth application knowledge for the company's Electronics markets.
  • Lead technical efforts on developmental and commercialized products by optimizing material application processes and interacting directly with customers to troubleshoot and resolve product and process issues.
  • Ensure that new and existing products are successfully employed by customers, delivering clear and identifiable value.
  • Solve technology-specific challenges across product lines or classes through innovative approaches to application process development, troubleshooting, and material characterization.

Qualifications: Required Qualifications

  • Minimum of a bachelor’s degree in Material Science/Engineering, Mechanical Engineering, Chemical Engineering, or a related field, with 10+ years of experience in a chemical environment for semiconductor advanced packaging.
  • Good understanding of the latest semiconductor packaging trends, especially 2.5D and 3D packages.
  • Expertise in wafer-level encapsulation and molding processes in semiconductor packaging.
  • Strong verbal communication skills for effective one-on-one discussions and group presentations, with proven ability to work both independently and as part of a team.
  • Demonstrated ownership and customer-oriented mindset with a clear understanding of customer needs and corporate culture.
  • Effective project and time management skills to drive projects to successful completion while consistently delivering high-quality work.
  • Willingness to travel up to 10% as part of the role.

Benefits: Benefits & Perks

  • Relocation Assistance Available

Required Skills

Application Engineering
Technical Communication
Troubleshooting & Debugging
Material Process Optimization
Molding Process
Semiconductor Advanced Packaging
Technical Service Engineering
Project Management
Wafer Level Encapsulation
Customer Interaction