HVM Field Process Engineer - PEALD, PECVD
ASM6 months ago
Chandler, AZ, United States
On-site
Full-time
Junior Level (1-3 years)
Job Description
Job Description
As a Field Process Engineer supporting PEALD Plasma-enhanced Atomic Layer Deposition (PEALD) and Plasma-enhanced Chemical Vapor Deposition (PECVD) on ASM's XP8 DCM/QCM platforms, you will act as the onsite process expert at customer HVM fabs. You will optimize deposition processes, resolve technical issues, and ensure tool performance meets customer and ASM requirements. This role is ideal for engineers who enjoy hands-on problem-solving, fast-paced environments, and contributing to next-generation semiconductor manufacturing.
Key Responsibilities
- Lead process qualification and optimization during tool installs and ramp-up.
- Execute structured DOEs to improve film quality, uniformity, and throughput.
- Troubleshoot process issues using systematic root-cause analysis.
- Partner with customer and ASM teams to drive continuous improvement and tool-to-tool matching.
- Document findings and share learnings across global teams.
Customer Engagement
- Build strong, trust-based technical relationships with customer engineers.
- Anticipate needs and provide sustainable, long-term solutions.
- Support escalations with clear communication and action plans.
- Represent ASM with professionalism and technical credibility.
What Makes You Successful
- Clear communication, strong troubleshooting methodology, and ability to stay composed under pressure.
- Highly collaborative, organized, and proactive in solving issues and driving improvements.
- Adaptable to changing priorities in a high-volume manufacturing environment.
Qualifications
- Degree: Master's or PhD in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or related fields.
- Experience: Experience with deposition processes (PEALD/PECVD), vacuum systems, metrology, and semiconductor manufacturing-preferably HVM and ASM tools.
- Skills: Strong DOE and experimental analysis skills.
- Travel: Ability to travel up to 25%; escalations may require extended hours/weekends.
- Understanding: Strong understanding of IP boundaries and confidentiality requirements.
Required Skills
Metrology
Continuous Improvement
Root-Cause Analysis
Collaborative Problem Solving
PECVD
Vacuum Systems
DOE (Design of Experiments)
Technical Communication
Process Optimization
PEALD