Memory Innovation Engineer, AI and Machine Learning
Micronabout 1 year ago
San Jose, California, United States
On-site
Full-time
Junior Level (1-3 years)
Job Description
Position Overview
Micron Technology, a world leader in innovating memory and storage solutions, is transforming how information enriches life. The Memory Innovation Engineer will pioneer next‐generation memory solutions for Datacenter and AI architectures through extensive technical collaboration with internal leadership and external industry partners. Compensation includes a US base salary range of $105,500.00 - $270,000.00.
Key Responsibilities
- Develop and implement a forward-looking innovative strategy for memory technologies in Datacenter and AI.
- Collaborate with internal teams and external partners to address complex technical challenges and identify growth opportunities.
- Contribute to the formulation of the business unit’s strategy for memory technology investments, considering market trends and manufacturability.
- Influence industry and customer directions to enhance Micron’s long-term portfolio.
Required Qualifications
- Ph.D. in Electrical Engineering, Computer Science.
- Educational background focused on Hardware Architecture or systems design (GPU, CPU, ASIC, chiplet, packaging, Datacenter systems).
- Ability to analyze complex memory and AI performance challenges.
Preferred Qualifications
- Understanding of memory hardware architectures and their impact on AI performance.
- Experience with DRAM design, engineering, quality, and architecture.
- Familiarity with near-memory solutions such as 3D stacking, chiplet, interposer and related system-level trade-offs.
- Strong collaboration and interpersonal skills.
Benefits & Perks
- Compensation Range: $105,500.00 - $270,000.00 (actual pay determined by location and additional factors).
- Comprehensive Medical, Dental, and Vision plans to meet diverse family healthcare needs.
- Income protection benefits including paid family leave and support if unable to work due to illness or injury.
- Robust paid time-off program and paid holidays to help you recharge.
Required Skills
Systems Design
AI/ML
3D Stacking
Technical Collaboration
Hardware Architecture
Memory Innovation
Chiplet Technology
Electrical Engineering
DRAM
Research and Development