Senior Reliability Engineer - IC Packaging
Micron Memory Malaysia Sdn Bhd6 months ago
Boise, ID, United States
Hybrid
Full-time
Junior Level (1-3 years)
Job Description
Position: Senior Package Reliability Engineer - IC Packaging
A leading technology company seeks a Package Reliability Engineer to ensure quality and reliability in semiconductor packaging. The role involves coordinating package qualification efforts for new products, developing tests to assess risks, and supporting customers on quality matters. Ideal candidates will have a BS in Engineering, experience in micro electronic packaging, and strong analytical skills. This position offers an opportunity to be part of an innovative team focused on delivering high-performance solutions.
Job Reference: #J-18808-Ljbffr
Required Skills
Analytical Skills
Micro Electronic Packaging
Risk Assessment
Reliability Testing
Quality Assurance
Customer Support